Mechanically flexible interconnects (MFIs) with highly scalable pitch
نویسندگان
چکیده
Mechanically flexible interconnects (MFIs) with highly scalable pitch (from 150 to 50 μm) and large vertical gap (65 μm) are reported for the first time in this paper. The wafer-level batch fabrication of the reported MFIs is enabled by photolithography on a highly non-uniform surface (65 μm high sacrificial domes) covered with a spray-coated photoresist. Based on finite element method simulations and experimental data, the mechanical compliance and resistance of the fabricated MFIs are reported.
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