Mechanically flexible interconnects (MFIs) with highly scalable pitch

نویسندگان

  • Pradeep Dixit
  • Chee Wee Tan
  • Luhua Xu
  • Chang-Hyeon Ji
  • Florian Herrault
  • Seung Wook Yoon
  • Pratul K Ajmera
  • Chaoqi Zhang
  • Hyung Suk Yang
  • Muhannad S Bakir
چکیده

Mechanically flexible interconnects (MFIs) with highly scalable pitch (from 150 to 50 μm) and large vertical gap (65 μm) are reported for the first time in this paper. The wafer-level batch fabrication of the reported MFIs is enabled by photolithography on a highly non-uniform surface (65 μm high sacrificial domes) covered with a spray-coated photoresist. Based on finite element method simulations and experimental data, the mechanical compliance and resistance of the fabricated MFIs are reported.

برای دانلود متن کامل این مقاله و بیش از 32 میلیون مقاله دیگر ابتدا ثبت نام کنید

ثبت نام

اگر عضو سایت هستید لطفا وارد حساب کاربری خود شوید

منابع مشابه

Heterogeneous 3D IC Stacking Using Ultra-Dense Mechanically Flexible Interconnects

This paper presents gold passivated dense NiW mechanically flexible interconnects (MFIs) for advanced 3D heterogeneous IC integration. The MFIs are fabricated with a pitch as small as 25 μm, a maximum height of 65 μm, and can be engineered to provide a wide range of mechanical stiffness and vertical range of motion within the elastic region. The compliance for the fabricated MFIs is measured to...

متن کامل

Cost Effective and Scalable Synthesis of MnO2 Doped Graphene in a Carbon Fiber/PVA: Superior Nanocomposite for High Performance Flexible Supercapacitors

In the current study, we report new flexible, free standing and high performance electrodes for electrochemical supercapacitors developed througha scalable but simple and efficient approach. Highly porous structures based on carbon fiber and poly (vinyl alcohol) (PVA) were used as a pattern. The electrochemical performances of Carbon fiber/GO-MnO2/CNT supercapacitors were characteriz...

متن کامل

All-Copper Chip-to-Substrate Interconnects Part II. Modeling and Design

A fabrication technique involving electroand electroless copper deposition was used to produce all-copper chip-to-substrate interconnects. This process electrolessly joins copper pillars, followed by annealing at 180°C. The process is tolerant to in-plane and through-plane misalignment and height variations. The mechanical compliance and electrical performance of copper-pillar chip-to-substrate...

متن کامل

Automated Forms Processing and Paper User Interfaces for Data Collection from Village Microfinance Groups

Microfinance is defined as the provision of financial services to poor, disadvantaged and under-privileged members of society, particularly in developing countries. Since the success of the Grameen Bank in the late 1970s, microfinance has emerged as a sustainable and effective method of poverty alleviation and local financial development. Recent years have witnessed an unprecedented growth in t...

متن کامل

Flexible, Aligned Carbon Nanotube / Conducting Polymer Electrodes for a Lithium-ion Battery

Carbon nanotubes (CNTs) present a new material for the construction of electrodes. The large scale production of aligned carbon nanotube (ACNT) arrays was first reported by Dai and co-workers [1], providing an opportunity to develop highly ordered, high surface area electrodes with excellent electronic and mechanical properties. While the latter two attributes are realized in the vertical direc...

متن کامل

ذخیره در منابع من


  با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید

برای دانلود متن کامل این مقاله و بیش از 32 میلیون مقاله دیگر ابتدا ثبت نام کنید

ثبت نام

اگر عضو سایت هستید لطفا وارد حساب کاربری خود شوید

عنوان ژورنال:

دوره   شماره 

صفحات  -

تاریخ انتشار 2014